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Special treatments

We are specialists in the area of powder surface treatment, but we also offer development of further processes such as hydrophobic treatment, plasma sputtering, and fine cleaning of micro surfaces or according to particular application. We cooperate with specialized laboratories and institutions, see section Research and development.

Hana Šourková
external consultant
tel.: +420 481 322 223
hana.sourkova@surface-treat.cz

Jiří Cerman
research and development
tel.:+420 481 322 223
jiri.cerman@surface-treat.cz

Hydrophobic plasma treatment

Hydrophobic surfaces find different potential applications in self-cleaning surfaces, such as surfaces with controlled wettability, anti-sticking and antifouling materials.

The laboratory microwave low-pressure system MAIII is used for realization equipped with evaporator to apply hydrophobic treatments. Low-pressure plasma treatment is typically operated as a batch process with advantage of providing more process parameters and allowing sophisticated and complicated processes.

The method uses the chemical precursor to achieve the hydrophobicity of the surface. Polysiloxanes such as hexamethyldisiloxane (HMDSO) are frequently used as hydrophobic agents in many applications. Moreover, HMDSO is well-known precursor in plasma enhanced polymerization processes.

HMDSO is vaporized in evaporator of liquid precursors connected to the vacuum chamber. HMDSO reacts with working gas and causes the changes of chemical composition onto the material surface or deposition of a thin layer.

Left side: contact angel 34°, silica glass
Right side: contact angel 40°, silica glass covered by hydrophobic silica

Hydrophobic layer deposited onto the surface of silica materials by low-pressure plasma treatment.

Hydrophobic treatment of cellulose for application in composite materials by low-pressure plasma treatment.

Plasma sputtering

The method serves for contrast enhancement contrast enhancement on interface of materials and particular different phases of microstructure in optical microscopy.

Definition

  • Equipment for optimal material structure visualization (enhancement of the dark areas and elimination of light areas and reflections mainly of surface layers or surface treated materials), visualization of material defects using optical microscopy.
  • Equipment enables perfect visualization of the contrast of different types of material in one place and their interface, which is not usually possible or only with difficulty with some kind of compromise for polished or etched samples
  • Samples preparation is very quick (ca 5 min) in dependence on the sample material and material used for encapsulation
  • Alternative method for the dangerous substances used for metalography
Cast iron with spherical graphite after galvanic treatment ZnNi and powder coating – micro section of the defect

Sample encapsulated in Epoxy resin DuroFast180°/325 bar/5 min., polished using colloid silica, photo Leica DM 2500 (left side figure), deposited by FeO – 3 min. / 3 mA (right side figure). Benefit of application after sputtering visual in the area marked with arrows (click for zoom).

Fe3Al (experimental material developed and tested by Technical University in Liberec, (Mechanical Engineering faculty, Department of materials) – visualization of surface layer after nitrocarburising.

Sample encapsulated in Epoxy resin with Cu filler, polished using colloid silica, photo Leica DM 2500 (left side figure), deposited by FeO – 4 min./2,7 mA (right side figure). Benefit of application after sputtering visual in the area marked with arrows (click for zoom).

AlSi cast after anodizing and coating – visualization of metallic filler coloration in paint

Sample encapsulated in Epoxy resin EpoFix, polished using colloid silica, photo Leica DM 2500 (left side figure), deposited by FeO – 5 min./1,7 mA (right side figure). Benefit of application after sputtering visual in the area marked with arrows (click for zoom).

Application examples with significant benefit in the area of visualization (photodocumentation)

Metalography (micro sections):

  • o glass fibers in PCB materials – printed circuit boards
  • o inhomogeneous materials, composites, resin with fillers
  • o microstructure of plastics with fillers
  • o lacquer coatings (transparent/colored)
  • o partially also microstructures of metals in sintered states (steel, solder, cast iron, etc.) – currently in development
Flaked layer on the stell surface

Sampleencapsulated in Epoxy resin DuroFast, polished using colloid silica, photoLeica DM 2500 (left side figure), deposited by FeO – 3 min./3 mA (right sidefigure). Benefit of application after sputtering visual in the area of thebasic material (steel) mainly in different coloration of ferrite and pearlite.

PCB after soldering using Sn solder – visualization of so called barrel crack

Sampleencapsulated in Epoxy resin EpoFix, polished using colloid silica, photo LeicaDM 2500 (left side figure), deposited by FeO – 4-5 min./2 mA (right sidefigure). Benefit of application after sputtering visual in the area marked witharrows.

PCB after soldering using Sn solder – interference contrast of the basic material PCB and Cu layer

Sampleencapsulated in Epoxy resin Technovit 4001, polished using colloid silica,photo Leica DM 2500 (left side figure), deposited by FeO – 3 min./3 mA (rightside figure). Benefit of application after sputtering visual in the area markedwith arrows.

Steel forged piece after surface galvanization using ZnNi and multilayer lacquering – micro section in the impurity between the lacquer layers

Sampleencapsulated in Epoxy resin DuroFast 180° / 325 bar / 5 min, polished usingcolloid silica, photo Leica DM 2500 (left side figure), deposited by FeO – 3min./3 mA 2x (right side figure). Benefit of application after sputteringvisual in the area marked with arrows.

Further information about equipment for plasma sputtering are available in the section „plasma systems“ .

We provide service in the area of small parts and micro surfaces cleaning according to specific requirements of the customer.

 Do not hesitate to contact us with your specific requirements and technical parameters. We will answer your questions in short time and offer possible solution.